I would like to cut some copper foil tape for use as a printed circuit board on PLA. The tape would be cut (with its backing on) across a board or other support to keep the tape spread out... the backing then removed and applied to a smooth PLA or other surface. I am told this can be done with a laser cutter. Has anyone tried this? What's the procedure for using unknown materials on the LC? Here's the tape I'd like to use: https://www.amazon.com/gp/product/B07QQJ4MX1/ref=crt_ewc_title_huc_1?ie=UTF8&psc=1&smid=A35842ASBR1GKG
I don't know whether this would work. I do know that adhesive backing can foul the lens on the laser. This has been successfully done on the vinyl cutter.
Thanks, I'll pursue it on the vinyl cutter then.
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