I would like to cut some copper foil tape for use as a printed circuit board on PLA.
The tape would be cut (with its backing on) across a board or other support to keep the tape spread out... the backing then removed and applied to a smooth PLA or other surface.
I am told this can be done with a laser cutter.
Has anyone tried this?
What's the procedure for using unknown materials on the LC?
Here's the tape I'd like to use:
https://www.amazon.com/gp/product/B07QQJ4MX1/ref=crt_ewc_title_huc_1?ie=UTF8&psc=1&smid=A35842ASBR1GKG

Thanks, I'll pursue it on the vinyl cutter then.