I would like to cut some copper foil tape for use as a printed circuit board on PLA.
The tape would be cut (with its backing on) across a board or other support to keep the tape spread out... the backing then removed and applied to a smooth PLA or other surface.
I am told this can be done with a laser cutter.
Has anyone tried this?
What's the procedure for using unknown materials on the LC?
Here's the tape I'd like to use:
I don't know whether this would work. I do know that adhesive backing can foul the lens on the laser. This has been successfully done on the vinyl cutter.
Thanks, I'll pursue it on the vinyl cutter then.
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